Sheet for forming pillar for glass panel unit, pillar mounting device for manufacturing glass panel unit, glass panel unit manufacturing method, and glass window manufacturing method

ABSTRACT

A glass panel unit manufacturing method includes a punching step and a pillar mounting step. In the punching step, a punch punches at least one of a plurality of portions from a base material of a sheet to form at least one pillar. Each of the plurality of portions is surrounded by a corresponding one of a plurality of loop-shaped grooves in the base material. In the pillar mounting step, the at least one pillar is mounted on a surface of a first substrate including a glass pane.

CROSS-REFERENCE OF RELATED APPLICATIONS

This application is the U.S. National Phase under 35 U.S.C. § 371 ofInternational Patent Application No. PCT/JP2017/040638, filed on Nov.10, 2017, which in turn claims the benefit of Japanese Application No.2016-220692, filed on Nov. 11, 2016, the entire disclosures of whichApplications are incorporated by reference herein.

TECHNICAL FIELD

The present invention relates to a sheet for forming pillars for a glasspanel unit, a pillar mounting device for manufacturing a glass panelunit, a glass panel unit manufacturing method, and a glass windowmanufacturing method.

BACKGROUND ART

Patent Literature 1 describes a glass panel unit including pillarssandwiched between a pair of substrates. Patent Literature 1 describes amanufacturing method including a step of manufacturing pillars, a stepof once storing the pillars thus manufactured, and a step of mountingthe pillars stored on one of the pair of substrates. Therefore, thismanufacturing method includes a large number of steps and is thusinefficient.

CITATION LIST Patent Literature

Patent Literature 1: JP H11-79799 A

SUMMARY OF INVENTION

It is an object of the present invention to efficiently manufacture aglass panel unit including pillars sandwiched between a pair ofsubstrates.

A sheet of one aspect of the present invention is a sheet for formingpillars for a glass panel unit and includes a base material having asheet-like shape. The base material has a plurality of loop-shapedgrooves. The base material has a plurality of portions serving as thepillars. Each of the plurality of portions is surrounded by acorresponding one of the plurality of loop-shaped grooves. Each of theplurality of loop-shaped grooves is a groove having a continuous ordiscontinuous loop shape.

A pillar mounting device of another aspect of the present invention is apillar mounting device for manufacturing of a glass panel unit andincludes the sheet, a punch configured to punch at least one of theplurality of portions from the base material of the sheet to form atleast one pillar, and a movement mechanism configured to move the atleast one pillar to a surface of a substrate including a glass pane.

A manufacturing method of still another aspect of the present inventionis a manufacturing method for a glass panel unit and includes a punchingstep, a pillar mounting step, and a bonding step. In the punching step,a punch and a sheet including a base material having a plurality ofloop-shaped grooves are prepared, and at least one of a plurality ofportions of the base material is punched from the base material by thepunch to form at least one pillar. Each of the plurality of portions issurrounded by a corresponding one of the plurality of loop-shapedgrooves. In the pillar mounting step, the at least one pillar is mountedon a surface of a first substrate including a glass pane. In the bondingstep, the first substrate and a second substrate including a glass paneare bonded together with a sealing member to form an inside spacebetween the first substrate and the second substrate so that the atleast one pillar is located in the inside space. Each of the pluralityof loop-shaped grooves is a groove having a continuous or discontinuousloop shape.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a partially cutaway side view schematically illustrating apillar mounting device of a first embodiment;

FIG. 2A is a perspective view illustrating a sheet which the pillarmounting device has, and FIG. 2B is a plan view illustrating a main partof the sheet;

FIG. 3 is a partially cutaway side view schematically illustrating howthe pillar mounting device punches the sheet;

FIG. 4 is a partially cutaway side view schematically illustrating howmembers in the pillar mounting device are displaced;

FIG. 5 is a perspective view schematically illustrating a pillarmounting substrate manufactured by the pillar mounting device and asubstrate to be bonded to the pillar mounting substrate;

FIG. 6 is a perspective view schematically illustrating a glass panelunit including the pillar mounting substrate manufactured by the pillarmounting device;

FIG. 7 is a flow diagram illustrating steps for manufacturing the glasspanel unit;

FIG. 8A is a plan view illustrating a main part of a variation of thesheet included in the pillar mounting device, and FIG. 8B is across-sectional view taken along line A-A of FIG. 8A;

FIG. 9 is a plan view schematically illustrating a variation of theglass panel unit including the pillar mounting substrate manufactured bythe pillar mounting device;

FIG. 10 is a cross-sectional view taken along line B-B of FIG. 9;

FIG. 11 is a flow diagram illustrating steps for manufacturing thevariation of the glass panel unit;

FIG. 12 is a plan view schematically illustrating a glass windowincluding the pillar mounting substrate manufactured by the pillarmounting device;

FIG. 13 is a flow diagram illustrating steps for manufacturing the glasswindow;

FIG. 14 is a perspective view schematically illustrating a pillarmounting device of a second embodiment;

FIG. 15 is a partially cutaway side view schematically illustrating howthe pillar mounting device of the second embodiment punches a sheet;

FIG. 16 is a partially cutaway side view schematically illustrating howthe sheet and a substrate in the pillar mounting device of the secondembodiment are displaced;

FIG. 17 is a partially cutaway side view schematically illustrating apillar mounting device of a third embodiment;

FIG. 18 is a partially cutaway side view schematically illustrating howthe pillar mounting device of the third embodiment punches a sheet;

FIG. 19 is a partially cutaway side view schematically illustrating howa pillar formed by the pillar mounting device of the third embodiment ismoved;

FIG. 20 is a partially cutaway side view schematically illustrating apillar mounting device of a fourth embodiment;

FIG. 21 is a partially cutaway side view schematically illustrating howthe pillar mounting device of the fourth embodiment punches a sheet;

FIG. 22 is a partially cutaway side view schematically illustrating howa pillar formed by the pillar mounting device of the fourth embodimentis moved;

FIG. 23 is a partially cutaway side view schematically illustrating apillar mounting device of a fifth embodiment;

FIG. 24 is a partially cutaway side view schematically illustrating howthe pillar mounting device of the fifth embodiment punches a sheet; and

FIG. 25 is a partially cutaway side view schematically illustrating howa pillar formed by the pillar mounting device of the fifth embodiment ismoved.

DESCRIPTION OF EMBODIMENTS First Embodiment

FIGS. 1, 3, and 4 each schematically illustrate a pillar mounting deviceof a first embodiment. The pillar mounting device of the presentembodiment is a device configured to mount pillars 14 on one surface 110of a substrate 11 to manufacture a pillar mounting substrate 100 (seeFIG. 5).

The pillar mounting substrate 100 forms a part of a glass panel unit 1and has a structure including a plurality of pillars 14 mounted on thesurface 110 of the substrate 11.

Another substrate 12 is placed on the pillar mounting substrate 100 toface the surface 110 of the substrate 11, and peripheral edges of thesubstrates 11 and 12 facing each other are bonded with a sealing member13 having a frame shape, thereby obtaining the glass panel unit 1 (seeFIG. 6) having an inside space 15.

The substrates 11 and 12 are both glass panes which are transparent butwhich may be semi-transparent or non-transparent. Moreover, thesubstrates 11 and 12 each include at least a glass pane and preferablyinclude a coating such as a thermal ray reflecting film in addition tothe glass pane.

In the following description, the substrate 11 and the substrate 12 arerespectively referred to as a “first substrate 11” and a “secondsubstrate 12” to be distinguished from each other.

As illustrated in FIGS. 1, 3, and 4, the pillar mounting device includesa substrate supporting part 5, a support table 2 installed above thesubstrate supporting part 5, a sheet 3 supported in a horizontalposition by the support table 2, and a punch 4 installed above the sheet3. In the figure, an arrow D1 indicates the up direction, and adirection opposite to the direction indicated by the arrow D1 is thedown direction.

The substrate supporting part 5 has a support surface 51 which supportsthe first substrate 11. The substrate supporting part 5 supports thefirst substrate 11 in a position in which the surface 110 faces upward.As long as the substrate supporting part 5 has a structure that enablesthe first substrate 11 to be supported in the above-described position,the substrate supporting part 5 may have any appropriate structure.

The support table 2 is provided to be located above the surface 110 ofthe first substrate 11 supported by the substrate supporting part 5.

The support table 2 has a through hole 21 penetrating therethrough inthe up-down direction. The support table 2 has an upper surface on whichthe sheet 3 is put to cover the through hole 21.

The sheet 3 includes a base material 30 in sheet form (film form). Thebase material 30 has a plurality of (a large number of) loop-shapedgrooves 32. The plurality of loop-shaped grooves 32 are disposed with adistance to one another in a matrix form (see FIG. 2A).

The base material 30 is preferably made of a resin, but other materialssuch as metal, glass, ceramic, or wood may be adopted as long as theyare materials that can be punched with the punch 4. As the base material30, a base material including a plurality of stacked resin layers may beadopted.

When the base material 30 is made of a resin, it is possible to formpillars 14 each having a low thermal conductivity. Moreover, when theresin of which the base material 30 is made is polyimide, excellent heatresistance is provided.

As illustrated in FIGS. 2A and 2B, the plurality of (a large number of)loop-shaped grooves 32 are formed in the base material 30 of the sheet 3in advance to surround respective portions 31 each having a round shapein plan view. Each of the loop-shaped grooves 32 includes so-calledperforations discontinuously formed by laser processing with, forexample, a laser machine. That is, each of the loop-shaped grooves 32includes a plurality of (three) grooves 321 each having an arc shape.Each of the loop-shaped grooves 32 is located to surround acorresponding one of the portions 31. Each of the portions 31 has around shape in plan view. These grooves 321 each having an arc shapepenetrate through the base material 30 in a thickness direction (theup-down direction) thereof. Between adjacent two of the grooves 321 eachhaving an arc shape, a connection portion 33 is formed. A means forforming each groove 321 is not limited to the laser processing. It isalso possible to form each groove 321 by another means such as etchingprocess.

The connection portions 33 in the sheet 3 of the present embodiment areformed at a plurality of locations (three locations) at equal intervalsin the circumferential direction along the outer shape of each portion31. The connection portions 33 are portions connecting the portion 31 ofthe base material 30 surrounded by the loop-shaped groove 32 to theremaining portion of the base material 30.

As illustrated in FIG. 1, the punch 4 includes a pin 42 protrudingdownward. The pin 42 has a columnar (cylindrical) shape. The pin 42 isconfigured such that a tip surface (lower surface) of the pin 42downward punches the portion 31 from the base material 30 of the sheet3. The portion 31 is surrounded by the loop-shaped groove 32. The sheet3 is supported by the support table 2. The through hole 21 in thesupport table 2 is located below the tip surface of the pin 42 with thesheet 3 placed between the tip surface and the support table 2. The pin42 has such a dimensional shape that allows the pin to penetrate throughthe through hole 21.

Next, a description is given of a manufacturing method of the pillarmounting substrate 100 by using the pillar mounting device of thepresent embodiment and further for manufacturing the glass panel unit 1including the pillar mounting substrate 100.

As illustrated in FIG. 7, the manufacturing method according to thepresent embodiment includes a disposition step S1, a punching step S2, apillar mounting step S3, a displacement step S4, a bonding step S5, anda process step S6. In the manufacturing method according to the presentembodiment, the punching step S2 and the pillar mounting step S3following the punching step S2 are repeated a plurality of times withthe displacement step S4 performed between sets each including thepunching step S2 and the pillar mounting step S3 which are repeated.Then, the bonding step S5 and the process step S6 are performed.

Each of the steps will be described below.

<Disposition Step>

In the disposition step S1, the substrate supporting part 5, the supporttable 2, the sheet 3, and the punch 4 are disposed (see FIG. 1) suchthat the substrate supporting part 5 supports the first substrate 11,the support table 2 is located above the first substrate 11, the supporttable 2 supports the sheet 3, and the punch 4 is located above the sheet3. The sheet 3 is disposed to cover the upper surface of the supporttable 2. The pin 42 included in the punch 4 is located directly abovethe through hole 21 in the support table 2 with the sheet 3 placedbetween the pin 42 and the support table 2.

<Punching Step>

In the punching step S2, the punch 4 including the pin 42 is drivendownward. The punch 4 is driven downward, and thereby, the pin 42 havinga columnar shape downward punches the portion 31 surrounded by theloop-shaped groove 32 from the base material 30 of the sheet 3 throughthe through hole 21 in the support table 2 (see the void arrow in FIG.3).

At this time, the connection portion 33 (see FIG. 2B) of the sheet 3 arebroken by external force exerted by the pin 42. As a result, the portion31 surrounded by the loop-shaped groove 32 is punched to have a columnarshape with reduced formation of burrs.

In particular, when the base material 30 of the sheet 3 is made of aresin, burrs are likely to be formed due to punching, but the pillarmounting device of the present embodiment effectively reduces the burrs.Similarly, when the base material 30 includes a plurality of resinlayers, burrs are likely to be formed due to punching, but the pillarmounting device of the present embodiment effectively reduces theformation of burrs.

<Pillar Mounting Step>

In the pillar mounting step S3, the portion 31 which has been punchedout downward by the pin 42 and which has a columnar shape is placed onthe surface 110 of the first substrate 11 with the portion 31 beingpressed onto the tip surface of the pin 42. The portion 31 having acolumnar shape and being placed on the surface 110 forms the pillar 14.

That is, in the manufacturing method of the present embodiment, the pin42 functions as a movement mechanism 7 (see FIG. 3). The pin 42 isconfigured to punch part of the base material 30 to form the pillar 14in the punching step S2. The movement mechanism 7 is configured to movethe pillar 14 immediately after being formed to the surface 110 of thefirst substrate 11.

Liquid such as water is preferably applied to a location on the surface110 of the first substrate 11 where the pillar 14 is to be placed. Thepresence of the liquid reduces dislocation of the pillar 14 on thesurface 110.

<Displacement Step>

In the displacement step S4, the pin 42 is displaced upward as indicatedby the void arrow in FIG. 4, and then, the first substrate 11 and thesheet 3 are displaced in the horizontal direction relative to thesupport table 2 and the punch 4 respectively. In the present embodiment,the travel direction of the first substrate 11 may be the same as ordifferent from the travel direction of the sheet 3.

FIG. 4 shows a case where the first substrate 11 and the sheet 3 aredisplaced, but the pillar mounting device may be configured such thatthe punch 4 and the support table 2 are displaced, or the pillarmounting device may be configured such that the first substrate 11 andthe sheet 3 are displaced and the punch 4 and the support table 2 aredisplaced. Alternatively, the pillar mounting device may be configuredsuch that the support table 2, the sheet 3, and the punch 4 aredisplaced relative to the first substrate 11 and the sheet 3 isdisplaced relative to the support table 2 and the punch 4.

As illustrated in FIG. 7, after the punching step S2, the pillarmounting step S3, and the displacement step S4 are performed in thisorder, a next punching step S2 and a next pillar mounting step S3 areperformed.

In the next punching step S2, of a large number of portions 31 includedin the sheet 3, a portion 31 which has not been punched and remains ispunched with the pin 42. The portion 31 thus punched forms anotherpillar 14. In the next pillar mounting step S3, the pillar 14 is mountedon the surface 110 of the first substrate 11 by the pin 42.

In the manufacturing method according to the present embodiment, thepunching step S2 and the pillar mounting step S3 following the punchingstep S2 are repeated a plurality of times with the displacement step S4performed between sets each including the punching step S2 and thepillar mounting step S3 which are repeated. While the relative positionbetween the punch 4 and the first substrate 11 is changed, the punchingstep S2 and the pillar mounting step S3 are performed a plurality oftimes, and thereby, the plurality of pillars 14 are mounted with adistance to each other on the surface 110 of the first substrate 11.

Thus, the pillar mounting substrate 100 (see FIG. 5) including aplurality of pillars 14 is efficiently manufactured.

When a large number of pillars are manufactured in advance and arestored as described in the prior art technique, the pillars may beadsorbed on each other due to static electricity or the like. Incontrast, according to the manufacturing method of the presentembodiment, it is possible to reduce pillars 14 adsorbed on each other.Thus, as a material for the pillars 14 (that is, as a material for thesheet 3), it is possible to adopt a material such as a resin which islikely to generate static electricity, and thus, the degree of freedomof selection of the material for the pillars 14 increases.

Moreover, the manufacturing method of the present embodiment reducesformation of burrs formed at the portion 31 punched from the basematerial 30. This increases the strength (compressive strength) of thepillar 14 formed of the portion 31.

<Bonding Step>

As illustrated in FIG. 5, in the bonding step S5, the sealing member 13having a frame shape is disposed on a peripheral portion of the surface110 of the first substrate 11. The sealing member 13 is located on thesurface 110 of the first substrate 11 to surround the plurality ofpillars 14.

Moreover, in the bonding step S5, the second substrate 12 is placed tosandwich the plurality of pillars 14 and the sealing member 13 betweenthe second substrate 12 and the first substrate 11, and the firstsubstrate 11 and the second substrate 12 are bonded together with thesealing member 13.

The inside space 15 is formed between the first substrate 11 the secondsubstrate 12 thus bonded (see FIG. 6). In the inside space 15, theplurality of pillars 14 are located. Each pillar 14 is in contact withthe first substrate 11 and the second substrate 12 and maintains thedistance between the first substrate 11 and the second substrate 12.

<Process Step>

In the process step S6, through a ventilation hole 16 (see FIG. 5) inthe second substrate 12, a pressure in the inside space 15 is reduced toa prescribed degree of vacuum (e.g., degree of vacuum lower than orequal to 0.1 Pa), or gas (dry air, argon, or the like) having thermalinsulation properties is supplied to the inside space 15, and then, theventilation hole 16 is sealed.

The process step S6 forms the glass panel unit 1 as illustrated in FIG.6. In the glass panel unit 1 shown in FIG. 6, a sealing site of theventilation hole 16 is omitted.

The glass panel unit 1 has the inside space 15 between the firstsubstrate 11 and the second substrate 12. The inside space 15 ishermetically sealed with a reduced pressure therein or with gas suppliedtherein. The glass panel unit 1 has the inside space 15 and thus has ahigh thermal insulation property.

There may be a case where the pressure in the inside space 15 is notreduced and gas is not supplied to the inside space 15. That is, a glasspanel unit 1 may be formed by a manufacturing method without the processstep S6. The glass panel unit 1 formed by this manufacturing method ofthe case also has thermal insulation properties to some extent.

Moreover, in the present embodiment, a large number of pillars 14 aredisposed with the substantially same distance to one another in a matrixform between the first substrate 11 and the second substrate 12.However, the number and locations of the pillars 14 are not particularlylimited. One pillar 14 may be disposed on the surface 110 of the firstsubstrate 11.

In the present embodiment, the loop-shaped groove 32 includes aplurality of grooves 321 penetrating the base material 30 of the sheet 3in the thickness direction of the base material 30. However, asillustrated in FIGS. 8A and 8B, the loop-shaped groove 32 may include anon-through groove 322. The non-through groove 322 is formed by laserprocessing on one surface of, for example, the sheet 3 to have acontinuous loop shape. A means for forming the loop-shaped groove 32having such a continuous shape is not limited to the laser processing,but another means such as an etching process enables the loop-shapedgroove 32 to be formed.

When the pin 42 is driven into the portion 31 surrounded by theloop-shaped groove 32 (non-through groove 322) in the base material 30,a bottom part of the loop-shaped groove 32 is broken, and the portion 31surrounded by the loop-shaped groove 32 is punched to have a columnarshape with reduced formation of burrs.

Note that not all the loop-shaped grooves 32 have to be non-throughgrooves. Some of the loop-shaped grooves 32 may be formed not topenetrate through the base material 30, and the other of the loop-shapedgrooves 32 may be formed to penetrate through the base material 30.Alternatively, the loop-shaped groove 32 may have a discontinuous loopshape and may be formed not to penetrate through the base material 30.

In the present embodiment, the loop-shaped groove 32 has an annularshape, but the shape of the loop-shaped groove 32 is not limited to thisembodiment. The shape of the loop-shaped groove 32 may be, for example,a polygonal shape (quadrangular shape, hexagonal shape, or the like), orother shapes (ellipse shape, Reuleaux triangle-shape, star shape, or thelike). In this case, the portion 31 surrounded by the loop-shaped groove32 is punched from the base material 30, thereby forming the pillar 14having a shape corresponding to the shape of the loop-shaped groove 32.

Moreover, in the present embodiment, the plurality of loop-shapedgrooves 32 are disposed with a distance to each other in the basematerial 30 of the sheet 3. However, no distance may be formed betweenadjacent loop-shaped grooves 32. For example, when each loop-shapedgroove 32 has a quadrangular shape, adjacent loop-shaped grooves 32 mayshare a part thereof (part on one side of the quadrangular shape). Inthis case, on the base material 30 of the sheet 3, a plurality of (alarge number of) portions 31 each having a quadrangular shape arearranged in rows and columns, that is, in a matrix form. The pluralityof (a large number of) loop-shaped grooves 32 each having a quadrangularshape and surrounding the portions 31 are combined altogether to form agrid groove structure including a plurality of longitudinal grooves anda plurality of lateral grooves transverse to one another. The portions31 surrounded by the respective loop-shaped grooves 32 are punched fromthe base material 30, thereby forming quadrangular prism pillars 14.

By using the pillar mounting device of the present embodiment, it ispossible to manufacture a variation of the glass panel unit 1 asillustrated in FIGS. 9 and 10 and it is possible to manufacture a glasswindow 6 as illustrated in FIG. 12.

The variation of the glass panel unit 1 illustrated in FIGS. 9 and 10includes a third substrate 17 and a frame member 181 in addition to thecomponents of the glass panel unit 1 shown in FIG. 6. The thirdsubstrate 17 is located to face the second substrate 12. The framemember 181 hermetically bonds entire peripheral portions of the secondsubstrate 12 and the third substrate 17 together.

The third substrate 17 includes at least a glass pane similarly to thefirst substrate 11 and the second substrate 12 and may adopt anappropriate panel. The third substrate 17 is transparent generally butmay be semi-transparent or non-transparent.

A space 185 which is sealed is formed between counter surfaces 120 and170 respectively of the second substrate 12 and the third substrate 17.

The third substrate 17 is located to face one of the first substrate 11and the second substrate 12. Although not shown in the figure, when thethird substrate 17 is disposed to face the first substrate 11, the framemember 181 is bonded to peripheral portions of the first substrate 11and the third substrate 17, and the space 185 is formed between thefirst substrate 11 and the third substrate 17.

As illustrated in FIG. 10, a spacer 182 is further disposed on an innerside of the frame member 181. The spacer 182 has a frame shape having ahollow. The hollow of the spacer 182 is filled with desiccant 184.

The spacer 182 is made of metal such as aluminum and has a through hole183 on an inner circumferential side thereof. The hollow of the spacer182 is in communication with the space 185 via the through hole 183. Thedesiccant 184 may be a silica gel, for example. The frame member 181 ispreferably made of, for example, a highly airtight resin such as asilicon resin and butyl rubber.

The space 185 is a space hermetically sealed with the second substrate12 (or the first substrate 11), the third substrate 17, and the framemember 181. The space 185 is filled with a dry gas. The dry gas is, forexample, a dry rare gas such as argon gas or dry air. The dry airincludes air dried after sealed in the space 185 due to the effect ofthe desiccant 184.

In the variation of the above-described glass panel unit 1, the insidespace 15 and the space 185 are provided between the third substrate 17and the first substrate 11 (or the second substrate 12), therebyproviding a high thermal insulation property. The third substrate 17 islocated on one end in a thickness direction of the glass panel unit 1,and the first substrate 11 (or the second substrate 12) is located onthe other end in the thickness direction. The inside space 15 has apressure reduced to a prescribed degree of vacuum or is supplied withgas. The space 185 is filled with a drying gas.

As illustrated in FIG. 11, the manufacturing method of the variation ofthe glass panel unit 1 includes a second bonding step S7 performed afterthe process step S6 in addition to the steps shown in FIG. 7. The secondbonding step S7 is a step of bonding the third substrate 17 to one ofthe first substrate 11 and the second substrate 12 with a frame member181 disposed between the third substrate 17 and the one of the firstsubstrate 11 and the second substrate 12.

A glass window 6 shown in FIG. 12 has a structure in which a windowframe 19 is fitted to the glass panel unit 1 shown in FIG. 6, and theglass window 6 has a high thermal insulation property. In the glasswindow 6, the sealing member 13 of the glass panel unit 1 is preferablyhidden by the window frame 19 when viewed from the front side.

As illustrated in FIG. 13, a manufacturing method of the glass window 6includes a fitting step S8 of fitting the window frame 19 to the glasspanel unit 1 in addition to the steps shown in FIG. 7.

A target to which the window frame 19 is fitted is not limited to theglass panel unit 1 as shown in FIG. 6. The window frame 19 may be fittedto a glass panel unit 1 as illustrated in, for example, FIGS. 9 and 10.In each case, a glass window 6 having a high thermal insulation propertyis obtained.

Second Embodiment

A pillar mounting device of a second embodiment will be described withreference to FIGS. 14 to 16. Of components of the pillar mounting deviceof the present embodiment, components similar to those of the firstembodiment are denoted by the same reference signs, and the detaileddescription thereof will be omitted. In the following description, ofthe components of the pillar mounting device of the present embodiment,components different from those of the first embodiment will be mainlydescribed.

A support table 2 included in the pillar mounting device of the presentembodiment has a plurality of through holes 21 (see FIG. 15). Theplurality of through holes 21 have the same dimensional shape and arelocated with a distance to one another. The plurality of through holes21 are located in a matrix form in plan view.

A punch 4 included in the pillar mounting device of the presentembodiment includes a plurality of pins 42. The plurality of pins 42have the same dimensional shape and are located with a distance to oneanother. The plurality of pins 42 are located in a matrix form in planview.

The arrangement pattern of the plurality of pins 42 corresponds to thearrangement pattern of the plurality of through holes 21 in plan view.The plurality of pins 42 may be driven into the plurality of throughholes 21 located below on a one-to-one basis. Note that the pillarmounting device of the present embodiment is configured to drive theplurality of pins 42 altogether but may be configured to drive theplurality of pins 42 individually.

Next, a manufacturing method of the glass panel unit 1 by using thepillar mounting device of the present embodiment will be described.Similarly to the manufacturing method of the first embodiment, themanufacturing method of the present embodiment includes a dispositionstep S1, a punching step S2, a pillar mounting step S3, a displacementstep S4, a bonding step S5, and a process step S6. In the followingdescription, detailed description of components in each step which aresimilar to those in the first embodiment is partially omitted.

<Disposition Step>

In the disposition step S1 of the present embodiment, a substratesupporting part 5, a first substrate 11, a support table 2, a sheet 3,and a punch 4 are disposed in this order (see FIG. 14).

The sheet 3 has a base material 30 in which a plurality of (a largenumber of) loop-shaped grooves 32 are formed in advance in a matrixform. The plurality of pins 42 are disposed to correspond to theplurality of loop-shaped grooves 32 on a one-to-one basis.

<Punching Step>

In the punching step S2, the plurality of pins 42 included in the punch4 are driven into the sheet 3 (see the void arrow in FIG. 15). Thus,through the plurality of through holes 21 in the support table 2,portions 31 surrounded by the plurality of loop-shaped grooves 32 arepunched downward from the base material 30. That is, in the presentembodiment, the plurality of portions 31 are punched from the basematerial 30 by one time of punching.

<Pillar Mounting Step>

In the pillar mounting step S3, the plurality of portions 31 punchedfrom the base material 30 with the plurality of pins 42 are, immediatelyafter being punched, mounted as is on a surface 110 of the firstsubstrate 11 by the plurality of pins 42. The plurality of portions 31mounted on the surface 110 form respective pillars 14.

That is, in the manufacturing method of the present embodiment, theplurality of pins 42 for forming the plurality of pillars 14 in thepunching step S2 functions as a movement mechanism 7 (see FIG. 15)configured to move the plurality of pillars 14 immediately after beingformed to the surface 110 of the first substrate 11.

Also in the present embodiment, liquid such as water is preferablyapplied to locations on the surface 110 of the first substrate 11 wherethe plurality of pillars 14 are to be mounted. The presence of theliquid reduces dislocation of each pillar 14 on the surface 110.

<Displacement Step>

In the displacement step S4, similarly to the first embodiment, theplurality of pins 42 are displaced upward, and then, the first substrate11 and the sheet 3 are displaced in the horizontal direction relative tothe support table 2 and the punch 4 respectively (see the void arrow inFIG. 16). Also in the present embodiment, the punching step S2 and thepillar mounting step S3 following the punching step S2 are repeated aplurality of times with the displacement step S4 performed between setseach including the punching step S2 and the pillar mounting step S3which are repeated. Thus, a pillar mounting substrate 100 including aplurality of (a large number of) pillars 14 is manufactured.

Note that when the punching step S2 is performed once, the pillarmounting substrate 100 may be manufactured. In this case, thedisplacement step S4 is not required.

<Bonding Step, Process Step>

The bonding step S5 and the process step S6 are similar to those in thefirst embodiment. Further performing both the steps S5 and S6 provides aglass panel unit 1 including the pillar mounting substrate 100 andhaving a high thermal insulation property.

Also in the manufacturing method of the present embodiment, similarly tothe variation described in the first embodiment, further performing asecond bonding step S7 enables a glass panel unit 1 including threelayers to be manufactured. Moreover, further performing a fitting stepS8 enables a glass window 6 having a high thermal insulation property tobe manufactured.

Third Embodiment

A pillar mounting device of a third embodiment will be described withreference to FIGS. 17 to 19. Of components of the pillar mounting deviceof the present embodiment, components similar to those of the firstembodiment are denoted by the same reference signs, and the detaileddescription thereof will be omitted. In the following description, ofthe components of the pillar mounting device of the present embodiment,components different from those of the first embodiment will be mainlydescribed.

The pillar mounting device of the present embodiment includes a supporttable 2, a sheet 3 held in a horizontal position by the support table 2,and a punch 4 installed above the sheet 3.

The support table 2 includes a lower member 23 and an upper member 24.The lower member 23 has a groove 231 that is recessed downward. Theupper member 24 has a through hole 241 penetrating therethrough in theup-down direction. An upper end of the groove 231 has an opening, and alower end of the groove 231 has a bottom surface 233. Between the lowermember 23 and the upper member 24, a small gap is provided, and thesheet 3 is disposed in the gap.

Similarly to the first embodiment, the sheet 3 has a base material 30 inwhich a plurality of (a large number of) loop-shaped grooves 32 areformed in a matrix form (see FIG. 2A).

The punch 4 has a suction pin 43 which has a hollow and which protrudesdownward. The suction pin 43 is configured such that a tip surface(lower surface) of the suction pin 43 downward punches a portion 31 fromthe base material 30 of the sheet 3. The portion 31 is surrounded by theloop-shaped groove 32. The sheet 3 is supported by the support table 2.The groove 231 in the lower member 23 is located below the tip surfaceof the suction pin 43 with the sheet 3 placed between the tip surfaceand the lower member 23.

The tip surface of the suction pin 43 has an inlet 431 formed therein.The inlet 431 is in communication with a space 45 formed in the punch 4through a hollow section 432 of the suction pin 43. Reducing a pressurein the space 45 with, for example, a vacuum pump enables the tip surfaceof the suction pin 43 to be in vacuum contact with the pillar 14.

Next, a manufacturing method of a pillar mounting substrate 100 by usingthe pillar mounting device of the present embodiment will be described.In the following description, detailed description of components in eachstep which are similar to those in the first embodiment is partiallyomitted.

<Disposition Step>

In a disposition step S1, the support table 2, the sheet 3, and thepunch 4 are disposed (see FIG. 17) such that the support table 2supports the sheet 3 and the suction pin 43 is located above the sheet3. The suction pin 43 is located directly above the groove 231 in thelower member 23 of the support table 2 with the sheet 3 placed betweenthe suction pin 43 and the lower member 23.

<Punching Step>

In the punching step S2, the suction pin 43 included in the punch 4 isdriven downward through the through hole 241 in the upper member 24. Thesuction pin 43 downward punches the portion 31 surrounded by aloop-shaped groove 32 from the base material 30 of the sheet 3 throughthe groove 231 of the lower member 23 downward (see the void arrow inFIG. 18).

At this time, connection portions 33 (see FIG. 2B) of the sheet 3 arebroken by external force exerted by the suction pin 43. As a result, theportion 31 surrounded by the loop-shaped groove 32 is punched to have acolumnar shape with reduced formation of burrs.

The portion 31 which is punched out with the suction pin 43 and whichhas a columnar shape is pressed against the bottom surface 233 of thegroove 231 with the portion 31 being pressed against the tip surface ofthe suction pin 43. The portion 31 having a columnar shape and beingpressed against the bottom surface 233 forms the pillar 14.

<Pillar Mounting Step>

In the pillar mounting step S3, the suction pin 43 is in vacuum contactwith the pillar 14 pressed against the tip surface. The punch 4 isdriven upward (see the void arrow in FIG. 19) with the vacuum contact ofthe suction pin 43 with the pillar 14 being maintained to move thepillar 14 to a prescribed location on a surface 110 of a first substrate11 (see, for example, FIG. 5).

That is, in the manufacturing method of the present embodiment, thesuction pin 43 functions as a movement mechanism 7. The suction pin 43is configured to punch part of the base material 30 to form the pillar14 in the punching step S2. The movement mechanism 7 is configured tomove the pillar 14 to the surface 110 of the first substrate 11.

<Displacement Step>

Although not shown, in the displacement step S4, after the punching stepS2 and the pillar mounting step S3 are performed, the sheet 3 isdisplaced in the horizontal direction relative to the support table 2.After the displacement step S4 is performed, a next punching step S2 anda next pillar mounting step S3 are performed.

In the next punching step S2, of a large number of portions 31 includedin the sheet 3, a portion 31 which is not punched and remains is punchedwith the suction pin 43. The portion 31 thus punched forms anotherpillar 14. In the next pillar mounting step S3, the pillar 14 is mountedon the surface 110 of the first substrate 11 by the suction pin 43.

Similar to the first embodiment, in the manufacturing method of thepresent embodiment, the punching step S2 and the pillar mounting step S3following the punching step S2 are repeated a plurality of times withthe displacement step S4 performed between sets each including thepunching step S2 and the pillar mounting step S3 which are repeated.Thus, the pillar mounting substrate 100 (see FIG. 5) including theplurality of pillars 14 is efficiently manufactured.

Steps of manufacturing a glass panel unit 1 and a glass window 6 eachincluding the pillar mounting substrate 100 thus manufactured aresimilar to the steps described in the first embodiment.

That is, also in the manufacturing method of the present embodiment, abonding step S5 and a process step S6 similar to those of the firstembodiment are further performed to manufacture a glass panel unit 1 asillustrated in FIG. 6. The bonding step S5, the process step S6, and asecond bonding step S7 similar to those of the first embodiment arefurther performed to manufacture a glass panel unit 1 having athree-layer structure as illustrated in FIGS. 9 and 10. The bonding stepS5, the process step S6, and a fitting step S8 similar to those of thefirst embodiment are further performed to manufacture a glass window 6as illustrated in FIG. 12.

In the pillar mounting device of the present embodiment, the punch 4includes one suction pin 43, but the punch 4 may include a plurality ofsuction pins 43. In this case, similar to the plurality of pins 42included in the pillar mounting device of the second embodiment, theplurality of suction pins 43 included in the punch 4 punch a pluralityof portions 31 from the base material 30 of the sheet 3, thereby forminga plurality of pillars 14. The plurality of suction pins 43 may bedriven altogether or individually.

The plurality of pillars 14 thus formed are mounted on the surface 110of the first substrate 11 with the plurality of pillars 14 being invacuum contact with the plurality of suction pins 43. In this case, theplurality of suction pins 43 function as movement mechanisms 7configured to move the plurality of pillars 14 thus formed to thesurface 110 of the first substrate 11.

A timing at which the suction pin 43 starts sucking air through theinlet 431 may be a timing at which the suction pin 43 punches a portion31 from the base material 30, or before or after this timing.

Fourth Embodiment

A pillar mounting device of a fourth embodiment will be descried basedon FIGS. 20 to 22. Of components of the pillar mounting device of thepresent embodiment, components similar to those of the first embodimentare denoted by the same reference signs, and the detailed descriptionthereof will be omitted. In the following description, of the componentsof the pillar mounting device of the present embodiment, componentsdifferent from those of the first embodiment will be mainly described.

The pillar mounting device of the present embodiment includes a table 81having a surface 810 which is flat and which faces upward, a supporttable 2 installed above the table 81, a sheet 3 supported in ahorizontal position by the support table 2, and a punch 4 installedabove the sheet 3. The configurations of the support table 2, the sheet3, and the punch 4 are similar to those in the first embodiment.

Next, a manufacturing method of a pillar mounting substrate 100 by usingthe pillar mounting device of the present embodiment will be described.In the following description, detailed description of components in eachstep which are similar to those in the first embodiment is partiallyomitted.

<Disposition Step>

In the disposition step S1, the table 81, the support table 2, the sheet3, and the punch 4 are disposed (see FIG. 20) such that the supporttable 2 is located above the table 81, the support table 2 supports thesheet 3, and the punch 4 is located above the sheet 3.

<Punching Step>

In the punching step S2, a pin 42 included in the punch 4 is drivendownward through a through hole 21 in the support table 2. The pin 42downward punches a portion 31 surrounded by a loop-shaped groove 32 froma base material 30 of the sheet 3 through the through hole 21 (see thevoid arrow in FIG. 21).

The portion 31 punched by the pin 42 forms a pillar 14. The pillar 14 isplaced on the surface 810 of the table 81 with the pillar 14 beingpressed against a tip surface of the pin 42.

<Pillar Mounting Step>

In the pillar mounting step S3, after the punch 4 is separated from thepillar 14, a suction tool 83 (see FIG. 22) different from the punch 4comes into vacuum contact with the pillar 14 placed on the table 81. Thesuction tool 83 has an end surface in which an inlet 831 is formed. Theinlet 831 is in communication with a space 835 formed in the suctiontool 83. Reducing a pressure in the space 835 with, for example, avacuum pump enables the inlet 831 of the suction tool 83 to be in vacuumcontact with the pillar 14.

The suction tool 83 moves the pillar 14 to a prescribed location on asurface 110 of a first substrate 11 (see, for example, FIG. 5) with thevacuum contact of the inlet 831 with the pillar 14 being maintained.That is, in the manufacturing method of the present embodiment, thesuction tool 83 functions as a movement mechanism 7 configured to movethe pillar 14 to the surface 110 of the first substrate 11.

<Displacement Step>

Although not shown, in the displacement step S4, the sheet 3 and thetable 81 are displaced in the horizontal direction relative to thesupport table 2. After the displacement step S4 is performed, a nextpunching step S2 and a next pillar mounting step S3 are performed.

In the next punching step S2, of a large number of portions 31 includedin the sheet 3, a portion 31 which has not been punched and remains ispunched with the pin 42. The portion 31 thus punched forms anotherpillar 14. In the next pillar mounting step S3, the pillar 14 is mountedon the surface 110 of the first substrate 11 by the suction tool 83.

The punching step S2 and the pillar mounting step S3 following thepunching step S2 are repeated a plurality of times with the displacementstep S4 performed between sets each including the punching step S2 andthe pillar mounting step S3 which are repeated. Thus, the pillarmounting substrate 100 (see FIG. 5) including a plurality of pillars 14is efficiently manufactured.

Steps of manufacturing a glass panel unit 1 and a glass window 6 eachincluding the pillar mounting substrate 100 thus manufactured aresimilar to the steps described in the first embodiment.

That is, also in the manufacturing method of the present embodiment, abonding step S5 and a process step S6 similar to those of the firstembodiment are further performed to manufacture a glass panel unit 1 asillustrated in FIG. 6. The bonding step S5, the process step S6, and asecond bonding step S7 similar to those of the first embodiment arefurther performed to manufacture a glass panel unit 1 having athree-layer structure as illustrated in FIGS. 9 and 10. The bonding stepS5, the process step S6, and a fitting step S8 similar to those of thefirst embodiment are further performed to manufacture a glass window 6as illustrated in FIG. 12.

In the pillar mounting device of the present embodiment, the punch 4includes one pin 42, but the punch 4 may include a plurality of pins 42.In this case, similar to the pillar mounting device of the secondembodiment, the plurality of pins 42 included in the punch 4 punch aplurality of portions 31 from the base material 30 of the sheet 3,thereby forming a plurality of pillars 14. The plurality of pins 42 maybe driven altogether or individually.

The plurality of pillars 14 thus formed are mounted on the surface 110of the first substrate 11 with the pillars 14 being in vacuum contactwith the plurality of suction tools 83. That is, the plurality ofsuction tools 83 function as movement mechanisms 7 configured to movethe plurality of pillars 14 thus formed to the surface 110 of the firstsubstrate 11.

Fifth Embodiment

A pillar mounting device of a fifth embodiment will be descried based onFIGS. 23 to 25. Of components of the pillar mounting device of thepresent embodiment, components similar to those of the first embodimentare denoted by the same reference signs, and the detailed descriptionthereof will be omitted. In the following description, of the componentsof the pillar mounting device of the present embodiment, componentsdifferent from those of the first embodiment will be mainly described.

The pillar mounting device of the present embodiment includes a supporttable 2, a sheet 3 held in a horizontal position by the support table 2,a punch 4 installed below the sheet 3, and a suction tool 85 installedabove the sheet 3.

The support table 2 includes a lower member 25 and an upper member 26.The lower member 25 has a through hole 251 vertically penetratingtherethrough. The upper member 26 has a through hole 261 verticallypenetrating therethrough. Between the lower member 25 and the uppermember 26, a small gap is provided, and the sheet 3 is disposed in thegap.

Similarly to the first embodiment, the sheet 3 has a base material 30 inwhich a plurality of (a large number of) loop-shaped grooves 32 areformed in a matrix form (see FIG. 2A).

The punch 4 has a pin 42 protruding upward. The pin 42 is configuredsuch that a tip surface (upper surface) of the pin 42 punches a portion31 upward from the base material 30 of the sheet 3. The portion 31 issurrounded by the loop-shaped groove 32. The sheet 3 is supported by thesupport table 2. The suction tool 85 is located above the tip surface ofthe pin 42 with the sheet 3 placed between the tip surface and thesuction tool 85.

The suction tool 85 has an end surface (lower surface) in which an inlet851 is formed. The inlet 851 is in communication with a space 855 formedin the suction tool 85. Reducing a pressure in the space 855 with, forexample, a vacuum pump enables the inlet 851 of the suction tool 85 tobe in vacuum contact with the pillar 14.

Next, a manufacturing method of a pillar mounting substrate 100 by usingthe pillar mounting device of the present embodiment will be described.In the following description, detailed description of components in eachstep which are similar to those in the first embodiment is partiallyomitted.

<Disposition Step>

In the disposition step S1, the support table 2, the sheet 3, the punch4, and the suction tool 85 are disposed such that the support table 2supports the sheet 3, the punch 4 is located below the sheet 3, and thesuction tool 85 is located above the sheet 3 (see FIG. 23). The pin 42of the punch 4 and the inlet 851 of the suction tool 85 are located onrespective sides of the sheet 3 (portion 31).

<Punching Step>

In the punching step S2, the pin 42 included in the punch 4 is drivenupward through the through hole 251 in the lower member 25. The pin 42upward punches a portion 31 surrounded by the loop-shaped groove 32 fromthe base material 30 of the sheet 3 through hole 261 of the upper member26 (see the void arrow in FIG. 24).

The portion 31 upward punched by the pin 42 and having a columnar shapeforms the pillar 14. The pillar 14 is pressed against the inlet 851 ofthe suction tool 85 with the pillar 14 being pressed against the tipsurface of the pin 42.

In the pillar mounting device of the present embodiment, the inlet 851of the suction tool 85 abuts on the portion 31 of the sheet 3 before thepin 42 is driven upward. The pillar mounting device of the presentembodiment is configured to pushes up both the portion 31 (pillar 14)and the suction tool 85 when the pin 42 punches the portion 31 from thebase material 30.

Note that before the pin 42 is driven, the suction tool 85 may be out ofcontact with the sheet 3. In this case, after the pin 42 punches theportion 31 from the base material 30, the suction tool 85 abuts on andsucks up the portion 31 (pillar 14).

<Pillar Mounting Step>

As illustrated in FIG. 25, in the pillar mounting step S3, while thesuction tool 85 is in vacuum contact with the pillar 14 which abuts onthe inlet 851, the suction tool 85 moves the pillar 14 to a prescribedlocation on a surface 110 of a first substrate 11 (see, for example,FIG. 5). That is, in the manufacturing method of the present embodiment,the suction tool 85 function as a movement mechanism 7 configured tomove the pillar 14 thus formed to the surface 110 of the first substrate11.

A timing at which the suction tool 85 starts sucking air through theinlet 851 may be a timing at which the pin 42 punches the portion 31from the base material 30, or before or after this timing.

<Displacement Step>

Although not shown, in the displacement step S4, after the punching stepS2 and the pillar mounting step S3 are performed, the sheet 3 isdisplaced in the horizontal direction relative to the support table 2,the punch 4, and the suction tool 85. After the displacement step S4 isperformed, a next punching step S2 and a next pillar mounting step S3are performed.

In the next punching step S2, of a large number of portions 31 includedin the sheet 3, a portion 31 which has not been punched and remains ispunched with the pin 42. The portion 31 thus punched forms anotherpillar 14. In the next pillar mounting step S3, the pillar 14 is mountedon the surface 110 of the first substrate 11 by the suction tool 85.

Similar to the first embodiment, in the manufacturing method of thepresent embodiment, the punching step S2 and the pillar mounting step S3following the punching step S2 are repeated a plurality of times withthe displacement step S4 performed between sets each of which includingthe punching step S2 and the pillar mounting step S3 which are repeated.Thus, the pillar mounting substrate 100 (see FIG. 5) including aplurality of pillars 14 is efficiently manufactured.

Steps of manufacturing a glass panel unit 1 and a glass window 6 eachincluding the pillar mounting substrate 100 thus manufactured aresimilar to the steps described in the first embodiment.

That is, also in the manufacturing method of the present embodiment, abonding step S5 and a process step S6 similar to those of the firstembodiment are further performed to manufacture a glass panel unit 1 asillustrated in FIG. 6. The bonding step S5, the process step S6, and asecond bonding step S7 similar to those of the first embodiment arefurther performed to manufacture a glass panel unit 1 having athree-layer structure as illustrated in FIGS. 9 and 10. The bonding stepS5, the process step S6, and a fitting step S8 similar to those of thefirst embodiment are further performed to manufacture a glass window 6as illustrated in FIG. 12.

In the pillar mounting device of the present embodiment, the punch 4includes one pin 42 and one suction tool 85 is provided, but the punch 4may include a plurality of pins 42, and a plurality of suction tools 85may be provided. In this case, similar to the pillar mounting device ofthe second embodiment, the plurality of pins 42 included in the punch 4punch a plurality of portions 31 from the base material 30 of the sheet3, thereby forming a plurality of pillars 14. The plurality of pins 42may be driven altogether or individually.

The plurality of pillars 14 thus formed are transported to the surface110 of the first substrate 11 and mounted on the surface 110 with thepillars 14 being in vacuum contact with the plurality of suction tools85. In this case, the plurality of suction tools 85 function as movementmechanisms 7 configured to move the plurality of pillars 14 to thesurface 110 of the first substrate 11.

The pillar mounting device, the glass panel unit manufacturing method,and the glass window manufacturing method of each embodiment have beendescribed above. However, design modification may be accordingly made toeach embodiment, and the configurations of the embodiments may also beaccordingly combined with each other.

(Effects)

As can be seen from each embodiment described above, a sheet 3 of afirst aspect, for forming pillars for a glass panel unit, includes abase material 30 having a sheet-like shape. The base material 30 has aplurality of loop-shaped grooves 32. The base material 30 has aplurality of portions 31 serving as the pillars 14, each of theplurality of portions 31 being surrounded by a corresponding one of theplurality of loop-shaped grooves 32.

With the sheet 3 of the first aspect, for forming the pillar for theglass panel unit, the plurality of portions 31 included in the basematerial 30 of the sheet 3 are punched while a glass panel unit 1 ismanufactured, thereby obtaining the plurality of pillars 14. Thus, thestep of once storing a large number of pillars 14 is not required, andtherefore, it is possible to reduce pillars 14 adsorbed on each other.In addition, since each portion 31 of the base material 30 is surroundedby the loop-shaped groove 32, formation of burrs at each portion 31(pillar 14) thus punched is reduced. Since formation of burrs reducesthe compressive strength of the pillar 14, the pillar 14 with reducedburrs provides a high compressive strength.

In a sheet 3 of a second aspect referring to the first aspect, forforming pillars for a glass panel unit, the base material 30 is made ofa resin.

With the sheet 3 of the second aspect, for forming the pillar for theglass panel unit, the plurality of portions 31 included in the basematerial 30 are punched while a glass panel unit 1 is manufactured,thereby obtaining the plurality of pillars 14 made of a resin. Theplurality of pillars 14 made of a resin generally has a property ofbeing easily adsorbed on each other due to static electricity, but thestep of once storing these pillars 14 is not required, and therefore,adsorption of the plurality of pillars 14 made of a resin on each otheris reduced. In addition, since each portion 31 of the base material 30is surrounded by the loop-shaped groove 32, formation of burrs at theportion 31 (pillar 14 made of a resin) is reduced.

In a sheet 3 of a third aspect referring to the first aspect, forforming pillars for a glass panel unit, the base material 30 includes aplurality of resin layers.

With the sheet 3 of the third aspect, for forming the pillar for theglass panel unit, the plurality of portions 31 included in the basematerial 30 are punched while a glass panel unit 1 is manufactured,thereby obtaining the plurality of pillars 14 made of a resin. Theplurality of pillars 14 made of a resin generally has a property ofbeing easily adsorbed on each other due to static electricity, but thestep of once storing these pillars 14 is not required, and therefore,adsorption of the plurality of pillars 14 on each other is reduced. Inaddition, since each portion 31 of the base material 30 is surrounded bythe loop-shaped groove 32, it is possible to reduce formation of burrsat each portion 31 (pillar 14 including a plurality of resin layers)punched out.

In a sheet 3 of a fourth aspect referring to any one of the first tothird aspects, for forming pillars for a glass panel unit, at least oneof the plurality of loop-shaped grooves 32 has a discontinuous loopshape. With the sheet 3 of the fourth aspect, for forming the pillar forthe glass panel unit, it is possible to effectively reduce formation ofburrs at the portion 31 (pillar 14) punched from the base material 30.

In a sheet 3 of a fifth aspect referring to any one of the first tothird aspects, for forming pillars for a glass panel unit, at least oneof the plurality of loop-shaped grooves 32 has a discontinuous loopshape and penetrates through the base material 30. With the sheet 3 ofthe fifth aspect, for forming the pillar for the glass panel unit, it ispossible to effectively reduce formation of burrs at the portion 31(pillar 14) punched from the base material 30.

In a sheet 3 of a sixth aspect referring to any one of the first tothird aspects, for forming pillars for a glass panel unit, at least oneof the plurality of loop-shaped grooves 32 has a continuous loop shape,and at least a part of the continuous loop shape does not penetratethrough the base material 30. With the sheet 3 of the sixth aspect, forforming the pillar for the glass panel unit, it is possible toeffectively reduce formation of burrs at the portion 31 (pillar 14)punched from the base material 30.

In a sheet 3 of a seventh aspect referring to any one of the first tosixth aspects, for forming pillars for a glass panel unit, each of theplurality of loop-shaped grooves 32 is a laser-processed loop-shapedgroove. With the sheet 3 of the seventh aspect, for forming the pillarfor the glass panel unit, it is possible to effectively reduce formationof burrs at the portion 31 (pillar 14) punched from the base material30.

A pillar mounting device of a first aspect, for manufacturing a glasspanel unit, includes the sheet 3 of any one of the first to seventhaspects, for forming the pillar for the glass panel unit, a punch 4configured to punch at least one of the plurality of portions 31 fromthe base material 30 of the sheet 3 to form at least one pillar 14, anda movement mechanism 7 configured to move the at least one pillar 14 toa surface 110 of a substrate 11 including a glass pane.

With the pillar mounting device of the first aspect, for manufacturingthe glass panel unit, it is possible to punch, at a timing immediatelybefore the pillar 14 is mounted, the portion 31 from the base material30 of the sheet 3 to obtain the pillar 14. Thus, a step of once storingand transporting a large number of pillars 14 is not required. Thus, itis possible to reduce pillars 14 adsorbed on each other. In addition,since each portion 31 of the base material 30 is surrounded by theloop-shaped groove 32, formation of burrs at each portion 31 (pillar 14)thus punched is reduced. The pillar 14 with reduced burrs provides ahigh compressive strength.

In a pillar mounting device of a second aspect referring to the firstaspect, for manufacturing a glass panel unit, the movement mechanism 7includes at least one pin 42 included in the punch 4. The at least onepin 42 is configured to punch the at least one of the plurality ofportions 31 from the base material 30 to form the at least one pillar14, and then move the at least one pillar 14 to the surface 110 of thesubstrate 11.

The pillar mounting device of the second aspect, for manufacturing theglass panel unit, enables both forming the pillar 14 and mounting thepillar 14 thus formed on the substrate 11 to be performed by the pin 42.

In a pillar mounting device of a third aspect referring to the firstaspect, for manufacturing a glass panel unit, the movement mechanism 7includes at least one suction pin 43 included in the punch 4. The atleast one suction pin 43 is configured to punch the at least one of theplurality of portions 31 from the base material 30 to form the at leastone pillar 14, and then move the at least one pillar 14 to the surface110 of the substrate 11 with the at least one pillar 14 being sucked upby the at least one suction pin 43.

The pillar mounting device of the third aspect, for manufacturing theglass panel unit, enables both forming the pillar 14 and mounting thepillar 14 thus formed on the substrate 11 to be performed by the suctionpin 43.

In a pillar mounting device of a fourth aspect referring to the firstaspect, for manufacturing a glass panel unit, the movement mechanism 7includes a suction tool 83 configured to suck up the at least one pillar14.

The pillar mounting device of the fourth aspect, for manufacturing theglass panel unit, enables the pillar 14 formed by punching to bepromptly mounted on the substrate 11 by using the suction tool 83.

In a pillar mounting device of a fifth aspect referring to the firstaspect, for manufacturing a glass panel unit, the punch 4 includes atleast one pin 42, and the movement mechanism 7 includes a suction tool35 configured to suck up the at least one pillar 14. The at least onepin 42 is configured to punch the at least one of the plurality ofportions 31 from the base material 30 to form the at least one pillar14, and then press the at least one pillar 14 against the suction tool85.

The pillar mounting device of the fifth aspect, for manufacturing theglass panel unit, enables the pillar 14 thus formed by punching to bepromptly mounted on the substrate 11 by using the suction tool 85.

A glass panel unit manufacturing method of a first aspect includes apunching step S2, a pillar mounting step S3, and a bonding step S5. Inthe punching step S2, a sheet 3 and a punch 4 are adopted. The sheet 3includes a base material 30 having a plurality of loop-shaped grooves32. The punch 4 punches at least one of a plurality of portions 31 fromthe base material 30 to form at least one pillar 14. Each of theplurality of portions 31 is surrounded by a corresponding one of theplurality of loop-shaped grooves 32 of the base material 30. In thepillar mounting step S3, the at least one pillar 14 is mounted on asurface 110 of a first substrate 11 including a glass pane. In thebonding step S5, the first substrate 11 and the second substrate 12including a glass pane are bonded together with a sealing member 13 toform an inside space 15 between the first substrate 11 and the secondsubstrate 12 so that the at least one pillar 14 is located in the insidespace 15.

According to the glass panel unit manufacturing method of the firstaspect, it is possible to punch, at a timing immediately before thepillar 14 is mounted on a first substrate 11, the portion 31 from thebase material 30 of the sheet 3 to obtain the pillar 14. Thus, a step ofonce storing and transporting a large number of pillars 14 is notrequired. It is possible to reduce pillars 14 adsorbed on each other. Inaddition, since each portion 31 of the base material 30 is surrounded bythe loop-shaped groove 32, formation of burrs at each portion 31 (pillar14) thus punched is reduced. The pillar 14 with reduced burrs provides ahigh compressive strength.

In a glass panel unit manufacturing method of a second aspect referringto the first aspect, the base material 30 is made of a resin.

According to the glass panel unit manufacturing method of the secondaspect, it is possible to punch, at a timing immediately before thepillar 14 is mounted on the first substrate 11, the portion 31 from thebase material 30 to obtain the plurality of pillar 14 made of a resin.The pillars 14 made of a resin are generally easily adsorbed on eachother due to static electricity, but since the step of once storing aplurality of these pillars 14 is not required, adsorption of the pillars14 on each other is reduced. In addition, since each portion 31 of thebase material 30 is surrounded by the loop-shaped groove 32, formationof burrs at the portion 31 (pillar 14 made of a resin) is reduced.

In a glass panel unit manufacturing method of a third aspect referringto the first or second aspect, in the pillar mounting step S3, the punch4 mounts the at least one pillar 14 on the surface 110 of the firstsubstrate 11.

The glass panel unit manufacturing method of the third aspect enablesboth forming the pillar 14 and mounting the pillar 14 thus formed on thesubstrate 11 to be performed by the punch 4.

In a glass panel unit manufacturing method of a fourth aspect referringto the third aspect, in the punching step S2 and the pillar mountingstep S3, the sheet 3 is located between the punch 4 and the firstsubstrate 11.

According to the glass panel unit manufacturing method of the fourthaspect, it is possible to mount the pillar 14 on the first substrate 11by the punch 4 immediately after the pillar 14 is formed by punching.

In a glass panel unit manufacturing method of a fifth aspect referringto the first or second aspect, the punch 4 includes at least one suctionpin 43. In the punching step S2, the at least one suction pin 43 punchesat least one of the plurality of portions 31 from the base material 30to form the at least one pillar 14. In the pillar mounting step S3, theat least one suction pin 43 mounts the at least one pillar 14 on thesurface 110 of the first substrate 11 while sucking up the at least onepillar 14.

The glass panel unit manufacturing method of the fifth aspect enablesboth forming the pillar 14 and mounting the pillar 14 thus formed on thesubstrate 11 to be performed by the suction pin 43.

In a glass panel unit manufacturing method of a sixth aspect referringto the first or second aspect, the punch 4 includes at least one pin 42.In the punching step S2, the at least one pin 42 punches at least one ofthe plurality of portions 31 from the base material 30 to form the atleast one pillar 14. In the pillar mounting step S3, a suction tool 83different from the punch 4 mounts the at least one pillar 14 on thesurface 110 of the first substrate 11 while sucking up the at least onepillar 14.

The glass panel unit manufacturing method of the sixth aspect enablesthe pillar 14 thus formed by punching to be promptly mounted on thefirst substrate 11 by the suction tool 83.

In a glass panel unit manufacturing method of a seventh aspect referringto the first or second aspect, the punch 4 includes at least one pin 42.In the punching step S2, the at least one pin 42 punches at least one ofthe plurality of portions 31 from the base material 30 to form the atleast one pillar 14 and the at least one pin 42 presses the at least onepillar 14 against a suction tool 85. In the pillar mounting step S3, thesuction tool 85 mounts the at least one pillar 14 on the surface 110 ofthe first substrate 11 while sucking up the at least one pillar 14.

The glass panel unit manufacturing method of the seventh aspect enablesthe pillar 14 thus formed by punching to be promptly mounted on thefirst substrate 11 by the suction tool 85.

In a glass panel unit manufacturing method of an eighth aspect referringto any one of the first to seventh aspects, the punching step S2 and thepillar mounting step S3 are repeated a plurality of times, and then, thebonding step S5 is performed.

The glass panel unit manufacturing method of the eighth aspect enablesefficient manufacturing of a glass panel unit 1 including a plurality ofpillars 14 sandwiched between the first substrate 11 and the secondsubstrate 12.

A glass panel unit manufacturing method of a ninth aspect referring toany one of the first to eighth aspects further includes a second bondingstep S7 of bonding a third substrate 17 to one of the first substrate 11and the second substrate 12 with a frame member 181 disposed between thethird substrate 17 and the one of the first substrate 11 and the secondsubstrate 12. The third substrate 17 includes a glass pane.

The glass panel unit manufacturing method of the ninth aspect enablesmanufacturing of a glass panel unit 1 having a further improved thermalinsulation properties.

A glass window manufacturing method of a first aspect includes a fittingstep S8 of fitting a window frame 19 to the glass panel unit 1manufactured by the glass panel manufacturing method of any one of thefirst to ninth aspects.

The glass window manufacturing method of the first aspect enablesefficient manufacturing of a glass window having a high thermalinsulation property.

The invention claimed is:
 1. A sheet comprising a base material having asheet-like shape, the base material having a plurality of loop-shapedgrooves, the base material having a plurality of portions serving aspillars for a glass panel unit having a pair of substrates and an insidespace between the pair of substrates, each of the plurality of portionsbeing surrounded by a corresponding one of the plurality of loop-shapedgrooves.
 2. The sheet of claim 1, wherein the base material is made of aresin.
 3. The sheet of claim 1, wherein the base material includes aplurality of resin layers.
 4. The sheet of claim 1, wherein at least oneof the plurality of loop-shaped grooves has a discontinuous loop shape.5. The sheet of claim 1, wherein the at least one of the plurality ofloop-shaped grooves has a discontinuous loop shape and penetratesthrough the base material.
 6. The sheet of claim 1, wherein: at leastone of the plurality of loop-shaped grooves has a continuous loop shape,and at least a part of the continuous loop shape does not penetratethrough the base material.
 7. The sheet of claim 1, wherein each of theplurality of loop-shaped grooves is a laser-processed loop-shapedgroove.